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Hysol ® 7902
Hot Melt Adhesive
Description
Hysol 7902 is a low viscosity, polyamide hot melt with a high softening point used extensively for potting and encapsulating in the electronics industry.
Typical Properties
Test Method
Softening Point, F 330 ASTM E 28
Viscosity @ 400 F, centipoise 600 *ASTM D 3236
Specific Gravity @ RT, g/cc .99 ASTM D 792
Heat Resistance, 2lb, F 284 ASTM D 4498
Application Temperature, F 400-450
* Brookfield RVT, Spindle SC4-27
Performance Characteristics
Tensile Lap Shear Strength, psi ASTM D 3163
Pine 380
Noryl 300
Application
Hysol offers a complete line of reliable, portable, hand held applicators specifically designed to accurately dispense all shaped hot melt formulations. There are many excellent bulk hot melt applicators available.
Packaging
Pellets in 40lb. cartons Polyshot in 25lb. pails.
Technical Consultation Service
Our technical staff and representative are ready to assist in solving any special bonding requirements. You are invited to take advantage of our extensive experience, laboratory services and trained field service staff. Call
800.323.5158 now and let us help you with your adhesive needs.
DISCLAIMER: The information supplied in this document is for guidance only and should not be construed as a warranty. All implied warranties
are expressly disclaimed. Including without limitation any warranty of merchantability and fitness for use: All users of the materials are responsible
for assuring that it is suitable for their needs, environment and use. All data is subject to change as Dexter deems appropriate.
Users should review the Material Safety Data Sheet (MSDS) and product label for the material to determine possible health hazards, appropriate
engineering controls and precautions to be observed in using the material. Copies of the MSDS and label are available upon request.
For
more information or to order contact the Glu Guru™ at 1-800-323-5158
or Email
mike@on-hand.com
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