Hysol
® 1C-LV
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® 1C-LV
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| Epoxy Adhesive | |
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Description Dexter Hysol 1C-LV is a lower viscosity version of EPK 1C modified for use in cartridges. Hysol 1C-LV is a general purpose adhesive and sealant that bonds, seals and repairs a wide variety of materials. Fully cured Hysol 1C-LV bonds offer superior thermal shock resistance, mechanical, electrical and impact resistant properties and low permeability to gases and vapors. The cured adhesive has good dimensional stability and resistance to water, weather, oxygen, and ozone, most petroleum products, mild acids and alkalis and many other chemicals. Recommended Substrates: Metals, wood, most plastics, fiberglass, ceramic. Features High shock resistance Room temperature cure Low permeability to gases and vapors Extremely low outgassing Properties Part A Part B Mixed Color White Tan Light Tan Viscosity, poise 620-1020 200-525 - Handling Mixing: This product is packaged in easy to use cartridges. Follow mixing and application instructions below. Part A Part B By Volume 2 1 Application Mixing - Cartridges: Place cartridge in proper dispenser. To begin using new cartridge, remove cap and dispense a small amount of adhesive, making sure both Part A and B are extruding. Attach nozzle and dispense approximately 1-2" before dispensing on to the part to be bonded. Partially used cartridges should be stored with the mixing nozzle attached. To reuse, remove and discard the old nozzle, attach new nozzle, and begin dispensing. Application: Bonding surfaces should be clean and dry. For optimum surface preparation, consult Dexter's Bulletin Preparing the Surface for Adhesive Bonding. Once the adhesive is applied, the bonded parts should be held in contact until the part has developed handling strength. It is not necessary to clamp the parts unless movement during cure is likely. Cure: Complete cure is obtained after 3 days at room temperature. After 24 hours, approximately 90% of full cure properties are attained. When in a bonded joint, Hysol 1C-LV will achieve handling strength in 4-6 hours at 77°F (note: this can very with different bond configurations). Hysol 1C-LV can also be cured with heat such as one hour at 180°F (82°C). Clean Up: It is important to remove excess adhesive from the work area before it hardens. Many common solvents and citrus cleaners are suitable for removing uncured adhesive. Consult with your supplier's information pertaining to the safe and proper use of solvents. Performance Tensile Lap Shear Strength: Tested on etched aluminum per ASTM D 1002 Cure Test Temp. °F Typical Results, psi 1 Hour @ 180°F 77 2100 Bulk Properties Hardness (Shore D) 3-Day Cure @ 77°F: 75 minimum Dielectric Strength, Volts/Mil 450 Tensile Strength, psi 2800 Elongation at Break, % 3.5 Pot Life @ 77°F (20 grams) 20 minutes Coefficient of Thermal Expansion 35 x 10-6 Packaging 50 and 200 ml. EPS Cartridge |
DISCLAIMER: The information supplied in this document is for guidance only and should not be construed as a warranty. All implied warranties are expressly disclaimed. Including without limitation any warranty of merchantability and fitness for use: All users of the materials are responsible for assuring that it is suitable for their needs, environment and use. All data is subject to change as Dexter deems appropriate. Users should review the Material Safety Data Sheet (MSDS) and product label for the material to determine possible health hazards, appropriate engineering controls and precautions to be observed in using the material. Copies of the MSDS and label are available upon request. |