Hysol ®9432NA
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Epoxy Adhesive
Description
Hysol® 9432NA is an aluminum filled heat curing one-part modified epoxy adhesive. This adhesive is formulated to provide excellent tensile shear strength and a high degree of impact resistance. Hysol 9432NA bonds well to oily and other poorly prepared surfaces and can be used successfully to bond a wide variety of substrates. This adhesive is designed to cure at moderate temperatures and has a long shelf life at room temperature. Hysol 9432NA lends itself well to pumping due to low viscosity but it is thixotropic enough to be applied to vertical surfaces without slumping.
Features
Excellent Tensile Shear Strength Thixotropic, Slump Resistant, Non-Sag
Smooth Pumpable Flow One Component Adhesive, No Mixing
Room Temperature Storage Tolerant of Poorly Prepared Substrates
Impact and Fatigue Resistant
Properties
Color Gray
Viscosity, Poise 1500 - 3000
Specific Gravity 1.38
Pounds per Gallon 11.5
Slump @300°F (3/8" diameter bead) 0 to 0.03"
Gun Flow @77°F (0.105" orifice), 42.5 psi 20 grams in 100-170 seconds
Operating Temperature Range -67 to 300°F
Application
Application: Allow the material to come to room temperature before use. Bonding surface should be clean, dry and properly prepared. For optimum surface preparation consult Dexter's Bulletin Preparing the Surface for Adhesive Bonding. Apply the adhesive to both substrates to be bonded. The bonded parts must be held in contact until the adhesive is cured.
Cure: Hysol 9432NA can be cured for 60 minutes at 250°F. Faster cures can be achieved by using higher temperatures, for example 30 minutes @ 300°F. Cure temperatures above 350°F are not recommended. Cure time on your part will depend upon factors such as part geometry, materials to be bonded, bondline thickness and efficiency of the oven. Cure schedule should be confirmed with actual production parts and equipment. A clamping pressure of 15 psi is recommended to ensure that good contact is maintained during cure cycle.
Clean Up: It is important to clean up excess adhesive from work area. Denatured alcohol and many common industrial solvents are suitable for removing uncured adhesive. Consult suppliers for information pertaining to the safe and proper use of solvents.
Performance
Tensile Lap Shear Strength: Tensile lap shear strength tested per ASTM D1002 after curing for 30 minutes at 300°F on 1" wide by 0.5" overlap specimens.
Bondline Test Tensile Lap Shear
Substrate Thickness, mils Temperature, °F Strength, psi
Etched Aluminum 5 -67 3500
5 77 3800
5 250 3000
5 300 2400
5 350 400
5 400 400
Degreased Aluminum 5 77 3500
16 Gauge Cold Rolled Steel
Degreased, Abraded 5 77 3000
Degreased 5 77 2850
Oily 5 77 2600
Low Profile Automotive
Grade SMC
Owens Corning Fiberglass 30 77 400 Fiber Tear The Budd Company 30 77 380 Fiber Tear
Fiberglass Vinyl Ester Laminate 30 77 1000 Substrate Failure
Peel Strength - Floating roller peel tested per ASTM D3167 at a crosshead speed of 6" per minute, after curing for 30 minutes @ 300°F.
Substrate Bondline Thickness, mils Test Temp, °F Peel Strength, pli
Etched Aluminum 10 77 7.5
Bulk Properties
Tensile properties tested at room temperature on 0.125 inch castings per ASTM D 638.
Tensile Strength, psi 7350
Tensile Modulus, psi 680,000
Elongation of Break, % 1.2
Shore D Hardness 90
Environmental Resistance
Reported as tensile lap shear strength tested at 77°F per ASTM D1002 after a 30 day soak in the specified fluid. Tensile lap shear on 16 gauge sandblasted cold rolled steel with 5 mil bondline cured for 30 minutes at 300°F having 1" wide by 0.5" overlap.
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