Hysol ®9460
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Epoxy Adhesive
Description
Hysol 9460 is a thixotropic, modified, two component epoxy adhesive formulated for ease of use as well for a good balance of properties. This adhesive couples high peel strength and excellent sheer strength in a smooth, non-sag paste that is easily dispensed. Hysol 9460 features a 1:1 mix ratio by weight and volume and has a long work life with a quick heat response. The tough, flexible nature of this structural adhesive makes it useful for bonding dissimilar substrates including metals, engineering thermoplastics and thermoset laminates such as sheet molding compound (SMC) without the use of primers.
Features
Excellent Peel Strength Excellent Tensile Sheer Strength Resistant to Automotive Fluids
Impact and Fatigue Resistant Non-Sag /Slump Resistant Easily Mixed/Easily Dispensed
Long Work Life Quick Heat Cure Response
Typical Properties
Part A Part B Mixed
Color White Black Grey
Viscosity, Poise @ 77oF 1500-3000 1000-2500 1500-2500
Specific Gravity 1.35 1.31 1.33
Density, Lbs/Gal 11.3 10.9 11.1
Handling
Mixing: Hysol 9460 requires mixing Part A and Part B together just prior to the application. Complete mixing is necessary.
Part A Part B
By weight 100 100
By volume 1 1
Pot life, 250 grams 40-50 minutes
Peak Exotherm, 250 grams 200oF
Application
Mixing – Bulk: Combine Part A (resin) and Part B (hardener) in the correct ratio and mix thoroughly. Continue to mix until all white and black streaks are gone and mix is uniformly gray. This is important! Heat build-up during or after mixing is normal. Do not mix quantities greater than ten pounds as excessive exotherm or heat build-up will develop. Mixing smaller quantities will minimize the heat build-up.
Mixing – Cartridges: Place cartridge in proper dispenser. To begin using a new cartridge, remove cartridge cap and dispense a small amount of adhesive, making sure Part A and Part B are extruding. Attach nozzle and dispense approximately 1-2" before applying onto the part being bonded. Partially used cartridges can be stored with mixing nozzle attached. To reuse, remove and discard the old nozzle, attach new nozzle and begin dispensing.
Application: Bonding surfaces should be clean and dry. For optimum surface preparation, consult Dexter's bulletin "Preparing the Surface for Adhesive Bonding". The bonded parts should be held in contact until the adhesive is set. It not necessary to maintain fixturing for the entire cure schedule but only until handling strength is achieved.
Cure: Hysol 9460 can be cured by a variety of cure schedules to meet processing requirements. 9460 will achieve handling strength in 6-8 hours at room temperature (note: this can vary with different bond configurations and ambient temperatures). Full cure time at 77oF is 3 days. After 24 hours, approximately 90% of full cure properties are attained. Heat cures up to 300oF can be used to reduce time. Graphs on the following page indicate alternative heat cure schedules which can be used to achieve a desired degree of cure from handling strength to full cure.
Clean up: It is important to remove excess adhesive from the work area and application equipment before it hardens. Many common solvents and citrus cleaners are suitable for removing uncured adhesive. Consult with your solvent supplier for information pertaining to the safe and proper use of solvents.
Performance
Tensile Lap Shear Strength Tested after 3 day cure @ 77oF
Substrate Bondline Test Typical Failure
Thickness, Mils Temp, oF Results Mode
Metals (per ASTM D1002)
Aluminum
